Chinese memory makers are carving out their space in the HBM segment, with a new local player kicking off trial production of the HBM2 process.
China’s making significant strides in the HBM market, as several manufacturers are stepping up with their unique solutions. Their aim? Outpacing global competitors in the AI race, an effort that’s become a top priority for the country, especially after President Biden’s administration imposed sanctions that could have potential impacts on China’s tech ambitions. Yet, these hurdles haven’t slowed the country’s pace. As reported by Nikkei, Tongfu Microelectronics, a Chinese company, has just embarked on HBM2 trial production, marking a significant milestone for their home-grown technology sector.
However, Tongfu isn’t sailing this ship alone. They’ve joined ranks with CXMT and Wuhan Xinxin, two other key players who’ve also been making waves in the DRAM and HBM markets recently. If Tongfu Microelectronics rings a bell, it might be because of their partnership with AMD, where they have a stake as a company shareholder.
Aside from their reputation as the world’s third-largest semiconductor packaging and test service provider, venturing into HBM is a new path for them. It’s probable that they’re sourcing memory and semiconductor components from outside suppliers, then leveraging their skills to assemble the HBM2 structure themselves.
Adding to their profile, there’s talk of Tongfu supplying AI processors to Huawei, although it’s unclear whether their HBM product is fully integrated into these systems yet. While HBM2 may seem a step behind, considering industry’s current focus on HBM4, this progress remains a noteworthy achievement for China. Despite external pressures, their domestic advancements continue to push forward. It appears it’s only a matter of time before China stands toe-to-toe with international benchmarks. The recent DeepSeek AI scenario underscores the rapid evolution unfolding within the country.
